Rewiring substrate strip having a plurality of semiconductor component positions
US7501701B2 · kind B2 · utility
0Cited by
15References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 12, 2006 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Nov 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A rewiring substrate strip (100) has a plurality of semiconductor component positions (2) for semiconductor components (3). The semiconductor component positions are arranged in rows and columns. A plurality of semiconductor component positions (2) can be combined to form a component group (5). The semiconductor components (3) of a component group (5) can be arranged with respect to one another in such a way that a single characteristic component edge (22) of a single semiconductor component is oriented with respect to one of the sawing tracks (12).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.