Semiconductor device and a method of manufacturing the same
US7504297B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2007 |
| Grant date | Mar 17, 2009 |
| Priority date | — |
| Expiry date | Apr 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/601
Abstract
A technology is provided where a high performance Schottky-barrier diode and other semiconductor elements can be formed in the same chip controlling the increase in the number of steps. After a silicon oxide film is deposited over a substrate where an n-channel type MISFET is formed and the silicon oxide film over a gate electrode and n+ type semiconductor region is selectively removed, a Co film is deposited over the substrate and a CoSi2 layer is formed over the n+ type semiconductor region and the gate electrode by applying a heat treatment to the substrate. After a silicon nitride film is deposited over the substrate and an aperture reaching the substrate is formed by removing the silicon nitride film and the silicon oxide film at the anode formation part of the Schottky barrier diode, a Ti film is deposited over the substrate including the inside of the aperture, and a TiSi2 layer which becomes an anode electrode of the Schottky-barrier diode is formed at the bottom of the aperture by applying a heat treatment to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.