Leveler compounds
US7510639B2 · kind B2 · utility
13Cited by
17References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2005 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Jan 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.