Sub-resolution assist feature to improve symmetry for contact hole lithography
US7512928B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2005 |
| Grant date | Mar 31, 2009 |
| Priority date | — |
| Expiry date | Apr 6, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/36
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a mask design having optical proximity correction features is provided. The method can include obtaining a target pattern comprising a plurality of target pattern features corresponding to a plurality of features to be imaged on a substrate. The method can also comprise generating a mask design comprising mask features corresponding to the plurality of features to be imaged on the substrate and controlling the aspect ratio of at least one of the features of the plurality of features to be imaged on the substrate by positioning a sub-resolution assist feature proximate to the corresponding mask feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.