Method of integrated circuit packaging
US7513035B2 · kind B2 · utility
10Cited by
34References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2006 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Sep 27, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid for covering an integrated circuit. The lid has a convex surface for applying pressure on the integrated circuit when the lid is placed in a selected position. In another aspect, an integrated circuit package device is provided that includes a lid that has a surface for applying pressure to an integrated circuit when the lid is in a selected position. A gold film is coupled to the surface. The gold film has a periphery and a plurality of rounds extending from the periphery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.