High density memory array for low power application
US7515455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2007 |
| Grant date | Apr 7, 2009 |
| Priority date | — |
| Expiry date | Jan 5, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C7/04
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory device includes a first bit line in a first conducting layer and a second bit line parallel to the first bit line. The second bit line is in a second conducting layer. The memory device includes a MOS select transistor and a word line coupled to a gate of the MOS select transistor. The word line is at an angle with respect to the first bit line and the second bit line. The memory device includes a first resistive memory element coupled between a source of the MOS select transistor and the first bit line. The memory device includes a second resistive memory element coupled between a drain of the MOS select transistor and the second bit line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.