Leadframe design for QFN package with top terminal leads
US7517733B2 · kind B2 · utility
115Cited by
9References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2007 |
| Grant date | Apr 14, 2009 |
| Priority date | — |
| Expiry date | Mar 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.