Method of processing a workpiece in a plasma reactor with dynamic adjustment of the plasma source power applicator and the workpiece relative to one another

US7520999B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Madhavi R. Chandrachood · Sunnyvale, US
• Richard Lewington · Hayward, US
• Darin Bivens · San Mateo, US
• Ajay Kumar · Fairport, US
• Ibrahim M. Ibrahim · Closter, US
• Michael N. Grimbergen · Redwood City, US
• Renee Koch · Brentwood, US
• Sheeba J. Panayil · Santa Clara, US

Key dates

• Filing date: May 3, 2006
• Grant date: Apr 21, 2009
• Expiry date: Apr 9, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/321
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

A method for processing a workpiece in a plasma reactor chamber by applying RF source power to inner and outer source power applicators, and introducing a process gas into the reactor while rotating at least one of (a) the workpiece, (b) the outer source power applicator, about a radial tilt axis to a position at which the plasma distribution is nearly symmetrical, and translating the inner source power applicator relative to the outer source power applicator along the axis of symmetry to a location at which the spatial distribution is nearly uniform.