Scheduling method for processing equipment

US7522968B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Steve Hongkham · San Ramon, US
• Eric A. Englhardt · Palo Alto, US
• Michael R. Rice · Pleasanton, US
• Helen R. Armer · Cupertino, US
• Chongyang Wang · Hejian, CN

Key dates

• Filing date: Jul 10, 2007
• Grant date: Apr 21, 2009
• Expiry date: Jul 10, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67276
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Methods and apparatus for increasing the processing throughput of multiple lots of semiconductor wafers through a cluster tool while maintaining a constant wafer history for each lot are provided. A first lot of wafers containing one through n-th wafers is introduced into a cluster tool containing one or more processing chambers. The first lot of wafers is processed for a first time period. A second lot of wafers containing one through n-th wafers is introduced into the cluster tool prior to completion of the first time period, wherein the second lot is introduced so as to minimize a time gap between the n-th wafer of the first lot of wafers and the first wafer of the second lot of wafers while maintaining a first constant wafer history for each wafer within the first lot and maintaining a second constant wafer history for each wafer in the second lot.