Solder interconnect structure and method using injection molded solder
US7523852B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2004 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Dec 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.