Patent · US Expired

Electronic component and a panel

US7524699B2 · kind B2 · utility

3Cited by

7References

4Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Edward Fuergut · Nuremberg, DE
Bernd Goller · Otterfing, DE
Robert-Christian Hagen · Sarching, DE
Simon Jerebic · Regensburg, DE
Jens Pohl · San Luis Obispo, US
Peter Strobel · Regensburg, DE
Holger Woerner · Regensburg, DE

Key dates

Filing date	Jul 8, 2004
Grant date	Apr 28, 2009
Priority date	—
Expiry date	Jul 8, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.