Image sensor with a protection layer
US7525139B2 · kind B2 · utility
4Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2004 |
| Grant date | Apr 28, 2009 |
| Priority date | — |
| Expiry date | Oct 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.