Patent · US Active

Apparatus and method for connecting components

US7525187B2 · kind B2 · utility

6Cited by

2References

30Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Roland Speckels · Kamen, DE
Alfred Kemper · Warstein, DE

Key dates

Filing date	Oct 13, 2006
Grant date	Apr 28, 2009
Priority date	—
Expiry date	Sep 11, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15787
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus for connecting at least two components contains a lower die and an upper die. The lower die has the components which are to be connected, with the first component supporting the at least second component with an at least partial overlap relative to the first component. The lower die and the upper die can be moved relative to one another. The upper die carries at least two heatable plungers which are connected so as to be able to move relative to one another via a sealed pressure pad. The plungers and the pressure pad have a first flexible layer between them. A second flexible layer is arranged between the upper die and the lower die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.