Fine pitch interconnect and method of making
US7528069B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2005 |
| Grant date | May 5, 2009 |
| Priority date | — |
| Expiry date | Apr 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Fine pitch contacts are achieved by using traces that extend to the contacts without requiring capture pads at the contact pads. Capture pads are desirably avoided because they have a diameter greater than the line to which they are attached. Preferably, adjacent contact pads are present in the same opening in the dielectric. The traces to the contact pads are in a line so that no widening is required where the lines make contact to the contact pads. The lines can be widened before they get to the contact pads but at the contact pads, they are substantially at the minimum width for the line. Thus, the contact pads can be at a pitch much lower than if capture pads were used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.