Semiconductor chip assembly with flexible metal cantilevers
US7532475B2 · kind B2 · utility
10Cited by
14References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Mar 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.