Inventor · Zürich, CH

Ryan J. Linderman

12Patents
8h-index
7Co-inventors
57Inventor score

Filing activity: Mar 30, 2006 → Feb 26, 2015

Most-cited inventions

PatentTitleAreaCited byStatus
US7808780B2 Variable flow computer cooling system for a data center and method of operation Emerging Cross-Sectional Technologies 37 Active
US8363402B2 Integrated circuit stack Electricity 32 Active
US7866173B2 Variable performance server system and method of operation Physics 27 Active
US7547582B2 Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies Electricity 24 Active
US8004832B2 Variable flow computer cooling system for a data center and method of operation Emerging Cross-Sectional Technologies 16 Active
US8107234B2 Variable flow computer cooling system for a data center and method of operation Emerging Cross-Sectional Technologies 11 Active
US7532475B2 Semiconductor chip assembly with flexible metal cantilevers Electricity 10 Expired
US8659898B2 Integrated circuit stack Electricity 10 Active
US10091909B2 Method and device for cooling a heat generating component Electricity 5 Active
US10278306B2 Method and device for cooling a heat generating component Electricity 2 Active
US9054074B2 One-dimensional hierarchical nested channel design for continuous feed manufacturing processes Emerging Cross-Sectional Technologies 0 Active
US7872867B2 Cooling system for an electronic component system cabinet Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.