Methods and apparatus for pressure control in electronic device manufacturing systems
US7532952B2 · kind B2 · utility
1Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2007 |
| Grant date | May 12, 2009 |
| Priority date | — |
| Expiry date | Mar 14, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04B49/00
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
In one aspect, improved methods and apparatus for pressure control in an electronic device manufacturing system are provided. The method includes acquiring information related to a current state of the electronic device manufacturing system, determining a desired value of a first parameter of the electronic device manufacturing system based on the acquired information and adjusting at least one parameter of a pump to obtain the desired value of the first parameter of the electronic device manufacturing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.