Method for providing uniform removal of organic material
US7534363B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2004 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Feb 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31138
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for removing organic material over a substrate is provided. The substrate is placed in a plasma processing chamber. A first gas is provided to an inner zone within the plasma processing chamber. A second gas is provided to an outer zone of the plasma processing chamber, wherein the outer zone surrounds the inner zone and the second gas has a carbon containing component, wherein a concentration of the carbon containing component of the second gas is greater than a concentration of the carbon containing component in the first gas. Plasmas are simultaneously generated from the first gas and second gas. Some or all of the organic material is removed using the generated plasmas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.