David R. Pirkle
13Patents
9h-index
31Co-inventors
68Inventor score
Filing activity: May 24, 1991 → Jun 28, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5234526A | Window for microwave plasma processing device | Electricity | 376 | Expired |
| US5915190A | Methods for filling trenches in a semiconductor wafer | Electricity | 283 | Expired |
| US5846373A | Method for monitoring process endpoints in a plasma chamber and a process monitoring arrangement in a plasma chamber | Electricity | 170 | Expired |
| US5647953A | Plasma cleaning method for removing residues in a plasma process chamber | Emerging Cross-Sectional Technologies | 111 | Expired |
| US6962879B2 | Method of plasma etching silicon nitride | Electricity | 29 | Expired |
| US6016766A | Microwave plasma processor | Electricity | 27 | Expired |
| US7334477B1 | Apparatus and methods for the detection of an arc in a plasma processing system | Electricity | 27 | Expired |
| US6670278B2 | Method of plasma etching of silicon carbide | Electricity | 23 | Expired |
| US7722778B2 | Methods and apparatus for sensing unconfinement in a plasma processing chamber | Electricity | 9 | Active |
| US5841623A | Chuck for substrate processing and method for depositing a film in a radio frequency biased plasma chemical depositing system | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6909195B2 | Trench etch process for low-k dielectrics | Electricity | 8 | Expired |
| US6794293B2 | Trench etch process for low-k dielectrics | Electricity | 6 | Expired |
| US7534363B2 | Method for providing uniform removal of organic material | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.