Integrated circuit package-on-package stacking system
US7535086B2 · kind B2 · utility
18Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2006 |
| Grant date | May 19, 2009 |
| Priority date | — |
| Expiry date | Jan 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and singulating the leadframe interposer from the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.