Optimized mounting area circuit module system and method
US7542297B2 · kind B2 · utility
4Cited by
281References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2005 |
| Grant date | Jun 2, 2009 |
| Priority date | — |
| Expiry date | Feb 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.