Patent · US Active

Semiconductor device with a wiring substrate and method for producing the same

US7545047B2 · kind B2 · utility

56Cited by

2References

17Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Edward Fuergut · Nuremberg, DE
Simon Jerebic · Regensburg, DE
Holger Woerner · Regensburg, DE

Key dates

Filing date	Nov 6, 2006
Grant date	Jun 9, 2009
Priority date	—
Expiry date	Apr 25, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15331
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound and a central region of a second plastic compound. A semiconductor chip is embedded with its back side and its edge sides in the second plastic compound, the active upper side of the semiconductor device being in a coplanar area with the first and second plastic compounds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.