Sacrificial spacer process and resultant structure for MEMS support structure
US7545552B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 19, 2006 |
| Grant date | Jun 9, 2009 |
| Priority date | — |
| Expiry date | Oct 19, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/017
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Disclosed is a microelectromechanical systems (MEMS) device and method of manufacturing the same. MEMS such as an interferometric modulator include a sidewall spacer formed adjacent to a movable mirror. The sidewall spacer may be a sacrificial spacer that is removed during fabrication, or it may remain in the final product. Increased clearance is provided between the movable mirror and a support structure during actuation of the movable mirror, thereby avoiding contact during operation of the interferometric modulator. The deformable layer may be deposited in a more continuous fashion over the contour of a lower layer as determined by the contour of the sidewall spacer, resulting in a stronger and more resilient deformable layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.