Interlayer dielectric and pre-applied die attach adhesive materials

US7550825B2 · kind B2 · utility

Assignee

• Henkel Limited

Inventors

• Benedicto delos Santos · San Diego, US
• James T. Huneke · San Diego, US
• Puwei Liu · San Diego, US
• Kang Yang · Ponca City, US
• Qing Ji · Albany, US

Key dates

• Filing date: Jun 5, 2007
• Grant date: Jun 23, 2009
• Expiry date: Jun 5, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31663
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.