Integration control and reliability enhancement of interconnect air cavities
US7553739B2 · kind B2 · utility
1Cited by
3References
21Claims
0Family size
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Key dates
| Filing date | Jul 11, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jul 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76849
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved semiconductor device, integrated circuit, and integrated circuit fabrication method introduce highly controlled air cavities within high-speed copper interconnects. A polymer material is introduced on the edges of interconnect lines and vias within an interconnect stack. This incorporates and controls air cavities formation, thus enhancing the signal propagation performance of the semiconductor interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.