Patent · US Expired

Plastic package and semiconductor component comprising such a plastic package, and method for its production

US7554196B2 · kind B2 · utility

8Cited by

13References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ulrich Bachmaier · Ruderting, DE
Michael Bauer · Nittendorf, DE
Robert-Christian Hagen · Sarching, DE

Key dates

Filing date	Oct 11, 2005
Grant date	Jun 30, 2009
Priority date	—
Expiry date	Dec 13, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A plastic package and to a semiconductor component including such a plastic package, as well as to a method for its production is disclosed. In one embodiment, the plastic package includes plastic outer faces, which include lower outer contact faces on a lower side of the plastic package and upper outer contact faces on an upper side, which are connected together via outer conductor tracks. The conductor tracks include conduction paths which are formed on exposed conducting deposits in the plastic package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.