High frequency IC package and method for fabricating the same
US7554197B2 · kind B2 · utility
9Cited by
1References
12Claims
0Family size
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Key dates
| Filing date | Apr 10, 2006 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jan 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the substrate in a manner that the bumps are inserted into the bump holes respectively. The conductive fillers are formed in the bump holes to electrically connect the bumps to the circuit layer of the substrate. The high frequency IC package has a shorter electrical path and a thinner package thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.