Methods and systems for inspection of a wafer
US7554656B2 · kind B2 · utility
7Cited by
31References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2005 |
| Grant date | Jun 30, 2009 |
| Priority date | — |
| Expiry date | Jun 30, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8854
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for inspection of a wafer are provided. One method includes illuminating the wafer with light at a first wavelength that penetrates into the wafer and light at a second wafer that does not substantially penetrate into the wafer. The method also includes generating output signals responsive to light from the wafer resulting from the illuminating step. In addition, the method includes detecting defects on the wafer using the output signals. The method further includes determining if the defects are subsurface defects or surface defects using the output signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.