Laser cleaning of backside of wafer for photolithographic processing
US7556712B2 · kind B2 · utility
18Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2006 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | Apr 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A photolithography process may be carried out after cleaning the backside of a wafer by means of an apparatus that includes an illumination module for conducting an optical illumination operation of photolithography to the front side of the wafer, and a cleaning module for conducting a cleaning operation on the wafer backside. Providing the capability of removing particles from the wafer backside and eliminating defocusing effects due to wafer chucking errors, these and other embodiments improve reliability of the photolithography process, as well as productivity and yields for the semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.