Light emitting devices having a roughened reflective bond pad and methods of fabricating light emitting devices having roughened reflective bond pads
US7557379B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2008 |
| Grant date | Jul 7, 2009 |
| Priority date | — |
| Expiry date | May 19, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Light emitting devices include an active region of semiconductor material and a first contact on the active region. The first contact is configured such that photons emitted by the active region pass through the first contact. A photon absorbing wire bond pad is provided on the first contact. The wire bond pad has an area less than the area of the first contact. A reflective structure is disposed between the first contact and the wire bond pad such that the reflective structure has substantially the same area as the wire bond pad. A second contact is provided opposite the active region from the first contact. The reflective structure may be disposed only between the first contact and the wire bond pad. Methods of fabricating such devices are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.