Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process

US7560381B2 · kind B2 · utility

Assignee

• Advanced Micro Devices, Inc. · US

Inventors

• Markus Nopper · Dresden, DE
• Axel Preusse · Radebeul, DE
• Matthias Bonkass · Dresden, DE

Key dates

• Filing date: Aug 25, 2005
• Grant date: Jul 14, 2009
• Expiry date: Mar 11, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/288
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

In an enhanced technique for electroless metal deposition, the substrate is heated to or above the operating temperature for the specific plating solution, while the plating solution may be maintained at a non-critical low temperature to substantially prevent spontaneous self-decomposition within the plating tool. Hence, significant advantages with respect to process control and cost of ownership may be achieved.