Inventor · Dresden, DE

Markus Nopper

16Patents
5h-index
15Co-inventors
55Inventor score

Filing activity: Jul 30, 2002 → Oct 25, 2010

Most-cited inventions

PatentTitleAreaCited byStatus
US6951816B2 Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst Electricity 17 Expired
US6620726B1 Method of forming metal lines having improved uniformity on a substrate Electricity 10 Expired
US8314494B2 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices Electricity 9 Active
US8883610B2 Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines Electricity 6 Active
US7781343B2 Semiconductor substrate having a protection layer at the substrate back side Electricity 5 Active
US6958247B2 Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process Electricity 5 Expired
US7899570B2 Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback Electricity 4 Active
US7947158B2 Apparatus and method for removing bubbles from a process liquid Electricity 1 Active
US7169664B2 Method of reducing wafer contamination by removing under-metal layers at the wafer edge Emerging Cross-Sectional Technologies 1 Expired
US7560381B2 Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process Electricity 1 Active
US7517782B2 Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase Electricity 1 Active
US7476552B2 Method of reworking a semiconductor structure Electricity 0 Active
US8389401B2 Contact elements of semiconductor devices formed on the basis of a partially applied activation layer Electricity 0 Active
US7781329B2 Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices Electricity 0 Active
US7615103B2 Apparatus and method for removing bubbles from a process liquid Electricity 0 Active
US8323471B2 Automatic deposition profile targeting Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.