Package optical chip with conductive pillars
US7560744B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2006 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | Aug 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure and a fabricating method thereof are provided. The package structure includes a soft board and an optical chip. The soft board has a surface with a bump disposed thereon. The optical chip includes a main body and a conductive pillar. The main body has an active surface and a non-active surface opposite to the active surface. The active surface has a sensing area and a contact pad electrically connected with each other. The non-active surface is attached to the surface. The conductive pillar is disposed inside the main body, and penetrates the active surface and the non-active surface. The conductive pillar has a first end electrically connected to the contact pad and a second end electrically connected to the bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.