Rewiring substrate strip with several semiconductor component positions
US7560801B2 · kind B2 · utility
1Cited by
7References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 19, 2005 |
| Grant date | Jul 14, 2009 |
| Priority date | — |
| Expiry date | May 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A rewiring substrate strip and a method of producing a rewiring substrate strip is disclosed. In one embodiment, the rewiring substrate strip has several semiconductor component positions for semiconductor components. The semiconductor component positions are arranged in rows and columns. In this arrangement, several semiconductor component positions are combined to form one component group. The semiconductor components of a component group are arranged with respect to one another in such a manner that an individual semiconductor component is rotated by 90° with respect to four adjacent semiconductor components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.