Microstructured sensor
US7564033B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2005 |
| Grant date | Jul 21, 2009 |
| Priority date | — |
| Expiry date | Jan 22, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a microstructured sensor, having at least one measurement chip in which there is formed a first measurement area having a first measurement structure and a second measurement area having a second measurement structure, the measurement areas being offset to one another in a lateral direction, one cap chip that is fastened in vacuum-tight fashion to the measurement chip in a connecting area, one intermediate space, formed between the measurement chip and the cap chip, that is sealed outwardly by the connecting area and in which the measurement areas are situated, and at least one contact area, formed on the measurement chip, and left exposed by the cap chip, for the contacting of the measurement chip. The sensor can be in particular a gas sensor for measuring a gas concentration, or an acceleration sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.