Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application
US7567090B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2006 |
| Grant date | Jul 28, 2009 |
| Priority date | — |
| Expiry date | Oct 23, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2877
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A heat sink for use in the burn-in of an I/C chip, which chip has a generally “flat” surface. The heat sink has a “flat” surface with micro-channels therein, positioned to open and close in and out of contact against the flat surface of an I/C chip being burned-in. At least one liquid opening communicates with said essentially flat surface on the heat sink to continuously apply liquid between the heat sink and the chip. A liquid inlet is provided to supply liquid to said at least one liquid opening. A recovery channel is positioned to recover liquid from between the heat sink and the chip, and an exhaust member is provided to carry liquid from said recovery channel to the exterior of the heat sink. The invention also includes a method of burning-in a chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.