Method for manufacturing a diaphragm sensor

US7569412B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Hubert Benzel · Neckartenzlingen, DE
• Frank Schaefer · Lörrach, DE
• Simon Armbruster · Wannweil, DE
• Gerhard Lammel · Lörrach, DE
• Christoph Schelling · Stuttgart, DE
• Joerg Brasas · Neckartenzlingen, DE

Key dates

• Filing date: Dec 13, 2004
• Grant date: Aug 4, 2009
• Expiry date: Jun 12, 2025

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/0115
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for producing a micromechanical diaphragm sensor includes providing a semiconductor substrate having a first region, a diaphragm, and a cavity that is located at least partially below the diaphragm. Above at least one part of the first region, a second region is generated in or on the surface of the semiconductor substrate, with at least one part of the second region being provided as crosspieces. The diaphragm is formed by a deposited sealing layer, and includes at least a part of the crosspieces.