Method of forming a wall structure in a microelectronic assembly
US7569424B2 · kind B2 · utility
25Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2006 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | Nov 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of forming a wall structure in a microelectronic assembly includes selectively depositing a flowable material on an upper surface of a first element in the microelectronic assembly, positioning a molding surface in contact with the deposited flowable material and controlling a distance between the upper surface of the first element and the molding surface with one or more objects positioned between the upper surface and the molding surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.