Semiconductor package-on-package system including integrated passive components
US7569918B2 · kind B2 · utility
10Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2006 |
| Grant date | Aug 4, 2009 |
| Priority date | — |
| Expiry date | May 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.