Patent · US Active

Method for measurement of a device under test

US7573283B2 · kind B2 · utility

1Cited by

5References

15Claims

0Family size

Assignee

SUSS MicroTec Test Systems GmbH · DE

Inventors

Axel Schmidt · Munich, DE
Frank Fehrmann · Hengshan, TW
Ulf Hackius · Dresden, DE
Stojan Kanev · Sacka, DE
Steffen Laube · Senftenberg - Zły Komorow, DE
Jorg Kiesewetter · Thiendorf, DE

Key dates

Filing date	Jun 19, 2007
Grant date	Aug 11, 2009
Priority date	—
Expiry date	Jun 30, 2027

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2891
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.