Smart card, smart card module, and a method for production of a smart card module

US7575173B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Edward Fuergut · Nuremberg, DE
• Bernd Goller · Otterfing, DE
• Robert-Christian Hagen · Sarching, DE
• Simon Jerebic · Regensburg, DE
• Jens Pohl · San Luis Obispo, US
• Peter Strobel · Regensburg, DE
• Holger Woerner · Regensburg, DE

Key dates

• Filing date: Jan 30, 2006
• Grant date: Aug 18, 2009
• Expiry date: Mar 30, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.