Process chamber component with layered coating and method
US7579067B2 · kind B2 · utility
14Cited by
75References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Aug 10, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing chamber component is capable of being exposed to an energized gas in a process chamber. The component has an underlying structure and first and second coating layers. The first coating layer is formed over the underlying structure, and has a first surface with an average surface roughness of less than about 25 micrometers. The second coating layer is formed over the first coating layer, and has a second surface with an average surface roughness of at least about 50 micrometers. Process residues can adhere to the surface of the second coating layer to reduce the contamination of processed substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.