Thin layer element and associated fabrication process
US7579226B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 19, 2005 |
| Grant date | Aug 25, 2009 |
| Priority date | — |
| Expiry date | Mar 6, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/26586
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for fabricating a thin layer element, in which a layer of a first material supports a pattern of a second material having a thickness of less than 15 nm, including a step of doping by implanting a chemical species over at least a portion of the layer-pattern assembly to stabilize the pattern on the layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.