Patent · US Active

Thin layer element and associated fabrication process

US7579226B2 · kind B2 · utility

0Cited by
9References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 19, 2005
Grant dateAug 25, 2009
Priority date
Expiry dateMar 6, 2027

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/26586
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method is provided for fabricating a thin layer element, in which a layer of a first material supports a pattern of a second material having a thickness of less than 15 nm, including a step of doping by implanting a chemical species over at least a portion of the layer-pattern assembly to stabilize the pattern on the layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.