Computer-implemented method for process control in chemical mechanical polishing
US7585202B2 · kind B2 · utility
3Cited by
79References
8Claims
0Family size
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Key dates
| Filing date | Oct 24, 2007 |
| Grant date | Sep 8, 2009 |
| Priority date | — |
| Expiry date | Oct 24, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.