Method of manufacturing semiconductor wafer
US7589023B2 · kind B2 · utility
5Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2001 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Aug 25, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a semiconductor wafer, comprising the step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by using an abrasive cloth with a semiconductor wafer sink rate different in polishing from that of the other abrasive cloth for one of a polishing cloth (14) on an upper surface plate (12) and a polishing cloth (15) on a lower surface plate (13) so as to simultaneously polish both the front and rear surfaces of the semiconductor wafer (W), or differentiating by differentiating the rotating speed of the upper surface plate from that of the lower surface plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.