Isoroku Ono
9Patents
4h-index
11Co-inventors
50Inventor score
Filing activity: Apr 23, 2001 → May 12, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7781309B2 | Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method | Electricity | 25 | Active |
| US7470169B2 | Method of polishing semiconductor wafers by using double-sided polisher | Performing Operations; Transporting | 24 | Expired |
| US7713842B2 | Method for producing bonded wafer | Electricity | 20 | Active |
| US7589023B2 | Method of manufacturing semiconductor wafer | Performing Operations; Transporting | 5 | Expired |
| US7855129B2 | Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method | Electricity | 3 | Active |
| US7718507B2 | Bonded wafer and method of producing the same | Electricity | 2 | Active |
| US8283252B2 | Method of manufacturing semiconductor wafer | Performing Operations; Transporting | 2 | Active |
| US7829436B2 | Process for regeneration of a layer transferred wafer and regenerated layer transferred wafer | Electricity | 1 | Active |
| US7951716B2 | Wafer and method of producing the same | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.