Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
US7589283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2007 |
| Grant date | Sep 15, 2009 |
| Priority date | — |
| Expiry date | Aug 15, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a circuitized substrate designed to substantially eliminate impedance disruptions during passage of signals through signal lines of the substrate's circuitry. The produced substrate includes a first conductive layer with a plurality of conductors on which an electrical component may be positioned and electrically coupled. The pads are coupled to signal lines (e.g., using thru-holes) further within the substrate and these signal lines are further coupled to a second plurality of conductive pads located even further within the substrate. The signal lines are positioned so as to lie between the substrate's first conductive layer and a voltage plane within a third conductive layer below the second conductive layer including the signal lines. A second voltage plane may be used adjacent the first voltage plane of the third conductive layer. Thru-holes may also be used to couple the signal lines coupled to the first conductors to a second plurality of conductors which form part of the third conductive layer. An electrical assembly and information handling system (e.g., computer) utilizing the substrate are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.