On-wafer AC stress test circuit

US7589551B1 · kind B1 · utility

Assignee

• UNITED MICROELECTRONICS CORP. · TW

Inventors

• Yun-Chi Yang · Hengshan, TW
• Chao-Yung Lai · Gongguan, TW
• Chao-Yang Lin · Monmouth Junction, US
• Cheng-Li Lin · Daxi District, TW
• Kuan-Cheng Su · Taipei, TW

Key dates

• Filing date: Apr 23, 2008
• Grant date: Sep 15, 2009
• Expiry date: Apr 23, 2028

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2884
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

To make an alternating current (AC) stress test easier to perform in a wafer, an AC stress test circuit for performing the AC stress test on a test device fabricated in a test region of the wafer includes an oscillator module fabricated in the test region, a diode module fabricated in the test region coupled to an output of the oscillator module, and a select transistor fabricated in the test region having a gate terminal coupled to an output of the diode module, a second terminal coupled to a gate of the test device, and a third terminal coupled to a test voltage source.