Image sensor chip package fabrication method
US7592197B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Nov 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
Abstract
An image sensor package method includes the steps of: first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.