Methods for coating and filling high aspect ratio recessed features

US7592254B2 · kind B2 · utility

Assignee

• The Board of Trustees of the University of Illinois · US

Inventors

• John R. Abelson · Urbana, US
• Sreenivas Jayaraman · Maumee, US
• Gregory S. Girolami · Champaign, US
• Yu Yang · Urbana, US
• Do-Young Kim · Paju-si, KR

Key dates

• Filing date: Oct 31, 2006
• Grant date: Sep 22, 2009
• Expiry date: Jun 1, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02107
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The present invention provides methods for conformally or superconformally coating and/or uniformly filling structures with a continuous, conformal layer or superconformal layer. Methods of the present invention improve conformal or superconformal coverage of surfaces and improve fill in recessed features compared to conventional physical deposition and chemical deposition methods, thereby minimizing formation of voids or gaps in a deposited conformal or superconformal layer. The present methods are capable of coating or filling features useful for the fabrication of a broad class of electronic, electrical and electromechanical devices.